DISTek Participates in COMVEC 2021

I had the opportunity once again this year to attend COMVEC 2021 with fellow DISTekians Nick Elliott and Benjamin Jefferson. COMVEC, (Commercial Vehicle Engineering Congress), is a conference sponsored by the SAE (Society of Automotive Engineers). It is dedicated to discussing the latest and future trends pertinent to commercial vehicles in the on-highway, agricultural, construction, industrial, military and mining sectors. The theme of this year’s conference was “Energy, Sustainability, and the Future of Commercial Vehicle Transportation”.

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COMVEC 2021 – Back in Person

You would have to be living under a pretty big rock to not realize that the in-person-conference scenario has changed quite a bit in the last 18 months.  I know of a few in-person events that have happened since most everything shut down in March 2020, but they are few and far between.  So,  needless to say, I am looking forward to a chance to get back together with some fellow industry professionals at SAE COMVEC in mid-September.  Of course, I expect there to be some differences from the last time we did in-person COMVEC, but as engineers, we live in a constant state of change anyway.

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DISTek Participates in 2020 Virtual SAE COMVEC

Each year in September, the Society of Automotive Engineers (SAE) holds a Commercial Vehicle Congress (COMVEC). At this event, engineers and technologists come together to collaborate on technologies for commercial trucks, defense vehicles, and off-highway equipment. DISTek has been a participant and exhibitor at COMVEC for many years. It is a perfect fit for our industry focus, and many of the technologies discussed are wholly, or partially, driven by electronics and software.

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2019: Year in Review

Our Milwaukee team enjoyed an evening of axe throwing at their holiday party

I just looked back at my Year in Review blog post for 2018 from a year ago, and I see that it was posted in late February with a stated goal to get the next one done on a timelier schedule. So here you go, hot off the press and still in January! In 2018...

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DISTek Participates in SAE COMVEC 2018

Somehow we find ourselves at the beginning of September already and for those of us here at DISTek, it means that the annual SAE COMVEC show is just around the corner. This year’s show will once again be held in Rosemont, Illinois at the Hyatt Regency O’Hare September 11th – 13th. DISTek will be involved in several capacities from sales hosting a booth on the exhibit floor to engineering attending the technical sessions and panels to stay up to date on the latest technology. We are also pleased to have one of our own, Daniel Aceituna, featured in an expert panel discussion.

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DISTek Attends SAE COMVEC 2017

A full session at this year's COMVEC

After a year off, DISTek revved up our marketing engine and returned to the much improved SAE COMVEC (Commercial Vehicle Engineering Congress) in Rosemont, Illinois. The show this year really took a deeper dive into technology.......

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2016: A Year in Review

Here at DISTek we just competed our 24th full calendar year as a company, which means our 25th anniversary happens in 2017. We are excited to think about our future as we pass this milestone, but it is also healthy to step back and review what we did in 2016. We took some bumps and bruises along the way – as did many in the industries we serve – but we also had some exciting successes.

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DISTek to Present at SAE COMVEC

comvec
SAE 2016

Ever design a system, and then see a human operator lock it up by behaving in a manner you never imagined they would? If yes, your system is vulnerable to Off-Nominal Behaviors (ONBs). ONBs are behaviors invoked upon a system (often, by unpredictable human operators) that were unaccounted for by the system’s designers because of their human tendency to assume that operators will use the system in a nominal manner.

In a paper to be presented at SAE COMVEC 2016, DISTek Integration, Inc. looks at addressing ONB vulnerability by using a requirements modeling technique known as Causal Component Model (CCM). You are welcome to attend the presentation or access the paper being........

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